The advanced technology behind the SYGNUS® implantable contact system has its origins in the Bal Conn, an electrical contact component that remains the stand-alone solution of choice for OEMs seeking to ensure consistent, reliable connections in neuromodulation and cardiac IPGs. For over two decades, the Bal Conn has been helping manufacturers improve device performance and push the technology envelope. It has also dramatically simplified the process surgeons use to connect lead wires to implantable electronic units across the therapy spectrum, shortening procedure times and reducing infection risk for patients. In addition to its very low electrical resistance, the Bal Conn offers redundant contact points, excellent resistance to fatigue and more design flexibility than any other IPG interconnect technology.
 

 

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